Qualcomm snatches Ventana Micro Systems
Brings more RISC-V manpower
Qualcomm Technologies has announced the acquisition of Ventana Micro Systems, a company specializing in compute chiplets based on the RISC-V open architecture.
Samsung’s Exynos 2600 looks boxed into Korea
Yield snags and Qualcomm deals keep the chip from travelling far
Samsung is still wrestling with ropey yields on its next-generation Exynos 2600, which means the silicon may only appear in South Korea and only in the non-Ultra Galaxy S26 models.
TSMC’s CoWoS backlog sparks outsourcing scramble
Taiwan giant turns to local partners as packaging crunch bites
TSMC is stuffed to the rafters with CoWoS orders, and the AI industry is sweating over it, although the company seems to have a cunning plan.
Honor Magic8 Lite comes with 7,500mAh battery
Snapdragon 6 Gen 4 SoC for the entry-level member of the series
Honor Magic8 Lite is finally official, and this least expensive member of Honor's Magic8 series will be packing Qualcomm's Snapdragon 6 Gen 4 SoC and a hefty 7,500mAh battery.
AWS grabs Nvidia gear to muscle into the big AI leagues
Amazon arms its cloud with chip tech while rivals circle.
Amazon’s AWS outfit is strapping Nvidia’s prized NVLink Fusion into a future Trainium4 chip as it tries to lure heavyweight AI customers onto its cloud turf.
Qualcomm pushes Snapdragon 8 Gen 5 into the spotlight
A not-quite-flagship aiming to look harder than it is
Qualcomm has pushed out another Android chip, and it seems ready to elbow its way into the phones that chase flagship swagger without paying flagship money.
TSMC races to build more 2nm fabs as demand crushes capacity
Taiwan’s chip colossus digs deeper into its pockets
The boss of the world’s biggest chip foundry has admitted that TSMC cannot churn out enough silicon to satisfy the world’s appetite.
Intel spies a fresh payday in fancy packaging
US customers eye local options
Advanced packaging is shaping up to be a massive prospect for Troubled Chipzilla as US chip designers start sniffing around for someone nearby to wrap their shiny silicon.
Intel suddenly looks useful again
Packaging kit gets unexpected love as TSMC struggles to keep up
Troubled Chipzilla's EMIB and Foveros packaging tricks, long overshadowed by TSMC’s dominance, are finally being treated as viable alternatives.
Samsung is stuck paying for Qualcomm chipsets
Weak Exynos yields and contract penalties keep Snapdragon in charge
Samsung’s next Galaxy flagships are shaping up to be a pricey headache as the dark satanic rumour mill claims the Snapdragon 8 Elite Gen 5 will power about 75 per cent of Galaxy S26 models worldwide.