
Samsung to show off three panelled phone
Multi-fold madness teased through One UI 8 leak
Samsung is getting ready to pull back the curtain on its next generation of bendy gadgets at its Unpacked event next week, with the Galaxy Z Fold 7, Galaxy Z Flip 7 and possibly the Galaxy Z Flip FE expected to make an appearance. But the real curiosity could be something even flappier: a tri-fold foldable going by the codename Multifold 7, possibly landing as the Galaxy G Fold.

Samsung can't find customers for shiny new US fab
White elephant
Samsung is dragging its feet over the launch of its chip fab in Taylor, Texas, thanks to an awkward lack of customers willing to buy what it plans to churn out.

Xiaomi’s Pad 7s PRO 12.5 targets iPad Pro and Samsung Tabs
Custom silicon, fast charging and Dolby Atmos in the mix
Xiaomi has stepped up its hardware game again, this time with the launch of the Pad 7S Pro 12.5, the first tablet powered by its in-house Xring O1 chipset.

Trump phone dumps "made in America claim"
So it is just an overpriced mid-range Chinese phone
Trump Mobile has quietly rewritten its tagline from “Made in the USA” to “brought to life right here in the USA” after just a week.

Samsung releases new Smart Monitor M-series
Including OLED M9, M8, and M7 models
Samsung has updated its latest Smart Monitor lineup, including the flagship Smart Monitor, the flagship M9 (M90SF) model, as well as the updated M8 (M80F) and the M7 (M70Fl) models.

TSMC still king of Foundry 2.0 while Intel chases its tail
Intel claws second place as Samsung stumbles over its yields
TSMC is still lording it over the global chip foundry racket, holding on to a 35 per cent grip on what is dubbed the "Foundry 2.0" which covers everything from photomask manufacturing to chip packaging alongside the usual silicon stamping.

Samsung dumps 1.4nm dreams for now
Bets farm on 2nm
Samsung’s foundry arm is pressing pause on its hyped 1.4nm production ambitions, opting instead to dump resources into its slightly less disastrous 2nm process.

Samsung eyes MediaTek’s new chip as Exynos fizzles
Dimensity 8450 could plug gap left by weak in-house silicon
MediaTek has rolled out its Dimensity 8450 chip at the India Dimensity Summit, offering a lightly reworked version of the 8400 it pushed out in December 2024. The real eyebrow-raiser, though, was Samsung turning up to the launch.

SK hynix gets Nvidia’s HBM4 gig
Beats Samsung and Micron
SK hynix has pulled ahead of its memory rivals by bagging NVIDIA’s first HBM4 orders, giving the South Korean chipmaker a premium position for the launch of Nvidia's Rubin GPUs.

Google dumping Samsung for TSMC leaves foundry flailing
“Google incident” forces soul‑searching at Samsung
Google’s decision to dump Samsung for TSMC to make its Tensor chips has reportedly caused chaos behind closed doors in South Korea.