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Professor Shintake's revolutionary EUV Lithography Tool

by on07 August 2024


Most efficacious in every case

A team of boffins lead by Professor Tsumoru Shintake of the Okinawa Institute of Science and Technology (OIST) has unveiled a groundbreaking and significantly simplified EUV lithography tool, poised to be more cost-effective than those developed by ASML.

He thinks that if the device reach mass production, it has the potential to transform the chipmaking equipment industry, and possibly the entire semiconductor sector.

The system employs merely two mirrors in its optical projection setup, a stark contrast to the conventional six-mirror configuration.

The primary challenge of such a system lies in aligning these mirrors in a straight line, ensuring high optical performance without the typical distortions associated with EUV light. This optical path allows over ten per cent of the initial EUV energy to reach the wafer, compared to approximately one per cent in standard setups.

Professor Shintake's team has addressed two major challenges in EUV lithography: preventing optical aberrations and ensuring efficient light transfer.

OIST's 'dual-line field' method illuminates the photomask without interfering with the optical path, minimising distortions and enhancing image precision on the silicon wafer.

In a paper on his invention, Shintake said that one of the key benefits of this streamlined design was its enhanced reliability and reduced maintenance complexities.

Additionally, this EUV lithography tool design drastically reduces power consumption. Thanks to the optimised optical path, the system operates with an EUV light source of just 20W, resulting in a total power consumption of less than 100kW. In contrast, traditional EUV lithography systems often require over 1MW of power. The lower power consumption means the new litho system does not need a sophisticated and expensive cooling system.

The performance of this new system has been rigorously verified using optical simulation software, confirming its capability for producing advanced semiconductors. The technology's potential has led to a patent filing by OIST, indicating readiness for commercial deployment.

The economic prospects of this invention are promising. The global EUV lithography market is projected to grow from $8.9 billion in 2024 to $17.4 billion by 2030. With this simplified design of EUV tools, the industry could see increased adoption of EUV systems in the coming years. However, the timeline for OIST's tool to reach commercialisation remains uncertain.

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