These ultra-thin packages are designed to enhance thermal control by using additional space within smartphones, a crucial feature as on-device AI applications become more prevalent.

The new LPDDR5X DRAM package, featuring a 4-stack structure, reduces thickness by 9 per cent and improves heat resistance by approximately 21.2 per cent compared to Samsung's previous generation.

The Korean technology giant achieved this by employing an optimised back-lapping process, refined PCB design, and advanced epoxy moulding compound techniques, resulting in a package as thin as 0.65 millimetres, the slimmest among existing LPDDR DRAM packages. This innovation is expected to enhance airflow, potentially leading to cooler devices.

Samsung has also disclosed plans to develop 6-layer 24GB and 8-layer 32GB modules in the thinnest LPDDR DRAM packages for future devices. These high-capacity packages are anticipated to power future Copilot+ PCs, introducing a new class of AI features.

Samsung Executive Vice President of Memory Product Planning YongCheol Bae said: "Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but advanced thermal management in an ultra-compact package."

The forthcoming Google Pixel 9 series may incorporate these advanced DRAM packages, enhancing on-device AI capabilities. Similarly, Samsung's Galaxy S25 series, expected in early 2025, is likely to use these new DRAM packages, providing even more sophisticated AI experiences for users.

This development underscores Samsung's leadership in memory technology innovation and signals a trend toward integrating AI capabilities in future flagship smartphones.